Tin Solder Wick Removal Desoldering Braid Tape Anti-Oxidation No Cleaning Low Residue Copper


Model: CP-2015
Length: Full 1.5 meters
weight: 9g
Purpose: Remove and remove tin from BGA pad detinning line


Solder Wick suction tape for desoldering is made of a weave of fine wires. It is an ideal solution for removing tin from soldering points by adhesion.
The braid is covered with a layer of flux - crystalline rosin. This shortens the time of tin absorption and does not cause the effect of overheating of the element.
With low residue design-- This solder braid helps clean spare solder on the pin away to avoid short circuit, especially great for small, hard to reach areas.
Pure oxygen free copper wire-- No clean flux for easy usage.The solder wick can help clean some residue flux and increase the speed of cleaning the PCB pad.


Can be used to correct mistakes with small boards on PCBs, remove relays and other components from printed circuit boards, re-solder mechanical keyboard switches, unsoldering old wire from devices, desoldering computer parts such as a motherboard and so on.